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Home » For Buyers » Electronics & Electrical » PCB & PCBA » Others » PCB copy,SMT,IC decipher
ShenZhen century KSIN Technology Co.,Ltd.
Selling Leads: PCB copy,SMT,IC decipher
Post Date Oct 8, 2007
Validity Date Oct 8, 2019
Business Category Electronics & Electrical » PCB & PCBA » Others
Country/Region China [CN]
Company Address RM306,RongSheng building,BaGua 3 road,ShenZhen,China.
Business Type
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1) PCB design

  We use the most advanced software, which allows us to accept virtually any type/format of PCB data, submitted by the customer. Apart from the traditional/regular ones, we use PROTEL software (designing software), which enables us to complete BGA design of 14-layered PCB and soldered with SMD components on both sides, with blind holes and bury holes and 256 feet within just 7 working days.

2) copy PCB

  Thanks to our experienced PCB designers and their experience in hardware development, we can guarantee the quickness and precision of copy PCB.

  Main board: Computer main board, 4-layered, track width and space between tracks 4 MIL Minimum diameter of PTH hole (=via)/min. PTH hole size 12 MIL

  Cell phone board: Cell phone main board, 8-layered, blind hole and bury hole technology/craft, track width and space between tracks 3 MIL

3) PCB production
Double-sided PCB

  • Golden finger + haloing (=tin plating/HAL=hot air leveling);

  • FR4 1.6 thick;

  • Sensitive green oil surface treatment;

  • track width and space between tracks 5MIL;

4-layered PCB

  • Golden finger + Mill edge;

  • FR4 1.6 thick;

  • Sensitive soldermask surface treatment;

  • track width and space between tracks 4MIL

10-layered PCB

  • Sinking metal + blind hole and bury hole;

  • FR4 1.6 thick;

  • Sensitive green oil surface treatment;

  • track width and space between tracks 4MIL;

Cell phone PCB

  • blind hole and bury hole + laser hole drilling;

  • track width and space between tracks 3 MIL;

  • FR4 1.0 thick

4) SMT processing

  Sample PCB: manual soldering, manual BGA interconnecting of layers flowback.

  Large scale processing: adopt fully automatic SMD (= surface mounting device)and interconnecting of layers flowback,etc.

 

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